The author recently made a management consultation with three packaging companies and found that the die-cutters of these packaging production companies are not very familiar with the quick-set indentation mold. When loading the die cutting board, often ask the workshop technician or workshop manager what type of indentation die to use, which not only wastes their time, but also brings a lot of extra work to the management staff. Obviously, this phenomenon is caused by the lack of ability of die-cutting workers, but it also reveals that the education and training of enterprises is not strong enough. Therefore, for the managers of enterprises, it is the basic work that an enterprise must do to train the operators of different positions in technology and skills, and to formulate practical operation instructions.
The following is a brief introduction to the quick-set indentation molds that have appeared in recent years.
1 Stress analysis of cardboard during indentation
During the indentation process of the cardboard, the cardboard is subjected to two pairs of shear forces on both sides of the crease groove. At the same time, the cardboard is also squeezed under the pressure of the steel wire. In addition, the outer layer of the cardboard is subjected to the tensile force, and The inner layer is subjected to compressive forces.
Therefore, under the joint action of the three forces, the molecular bond between the fiber surfaces in the internal structure of this part of the cardboard is destroyed, and an irreversible displacement occurs between the fiber surfaces, that is, the cardboard is permanently deformed.
If the tensile force of the outer layer and the compressive force of the inner layer exceed the cohesive force between the layers of the cardboard, the inner layers of the cardboard will split, making the folding points soft and flexible; if this force is too large, the outer layer of the cardboard will break, Therefore, the pressure should be controlled according to the paper's ability to withstand.
2 Use of quick-set indentation mold
The quick-set indentation die is an auxiliary material commonly used in the die-cutting process that has emerged in recent years. The material can be quickly pasted on the die-cut indentation base plate, which is very convenient and fast to use, and the indentation quality is stable.
The quick-loading indentation mold is mainly composed of four parts: the indentation mold, the positioning plastic strip, the elastic film, and the protective adhesive tape. Among them, the indentation mold completes the indentation of the printed matter; the positioning plastic strip is used to determine the exact position of the indentation mold when installing the indentation mold; the function of the elastic bottom film is to paste the indentation mold on the die-cutting indentation bottom plate Top; protective adhesive tape is used to protect the bottom adhesive during daily transportation or storage.
Matters needing attention when using the quick-set indentation mold: â‘ Do not store it in a high-temperature and high-humidity environment, so as not to cause poor adhesion of the primer; â‘¡ Before using the quick-set indentation mold, do not put the adhesive base behind it Uncover the paper; â‘¢Before transferring the quick-set indentation die to the die-cutting bottom plate, be sure to wipe the bottom plate to avoid the adhesion of dust, paper wool and oil on the bottom plate; â‘£ To prevent the die-cutting process When there is a shift, you can apply an instant adhesive around the indentation film.
3 Selection of quick-set indentation film
The specification of quick-loading indentation film adopts the marking method of indentation groove depth (mm) × indentation groove width (mm). Therefore, the quick-loading indentation film should be selected according to the thickness of the paper and the thickness of the indentation steel wire.
The selection principle of indentation groove depth: for board paper, it is about the thickness of board paper; for corrugated board, it is the thickness of cardboard after compaction.
Selection principle of indentation groove width:
For general board paper, the width of the indentation groove can be calculated by the following formula:
B = (1.3-1.5) C + d
Where: B is the width of the indentation die groove, C is the compacted thickness of the cardboard, and d is the thickness of the steel wire.
When the direction of the cardboard thread is parallel to the indentation die, the coefficient takes a low value; when the direction of the cardboard thread is perpendicular to the indentation die, the coefficient takes a high value.
For corrugated cardboard, the width of the creasing die groove can be calculated by the following formula:
B = (1.8-2.0) C + d
In the formula: B is the width of the indentation die groove, C is the compacted thickness of the corrugated cardboard, and d is the thickness of the steel wire.
When the direction of the corrugated cardboard is parallel to the indentation die, the lower value is taken; when the direction of the corrugated cardboard is perpendicular to the indentation die, the coefficient is taken to be a higher value.
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