New flexible backplane is thinner and safer

At the 34th International Electronic Circuit Industry Exhibition (JPCAshow 2004) held recently in 2004, Kyocera Chemical Co., Ltd. of Japan demonstrated a flexible backing material with an epoxy resin and a minimum thickness of 4 μm—“Super Thin”.

Flexible backplanes are mainly used in digital home appliances. Prior to this, other companies had a minimum thickness of 12μm. In order to meet the trend of the consumer market, electronic equipment manufacturers, such as LCD panels, digital cameras, and mobile phones, hope that component suppliers can provide thinner, more flexible flexible backing materials. This new type of flexible base plate not only has similar dimensional stability to a rigid base plate, but also has excellent bending properties. Kyocera Corporation of Japan uses an aromatic polyamide instead of the original polyimide to make the base plate thinner, and this material is halogen-free, flawless, safe and hygienic. At present, the company has sample supply.

According to experts, general flexible substrates use adhesives to bond copper foils to polyimide films, but polyimide films are in short supply. The use of aromatic polyamides is nearly 20% cheaper than the use of polyimide products. The glass cloth of the bottom plate is also reinforced with epoxy resin.